| Features |
Target Applications / Gases |
 |
Zero Scrubber Related Process Tool Downtime |
EPI |
|
Field Proven (>1000 units) |
|
Chlorosilanes |
|
Higher Wafer Yields |
|
Hydrogen Chloride |
|
Max. Flow Rate of Input Gas is 600SLM |
Poly Etch / CVD |
|
99.999% Removal of Water Soluble Gases |
|
ALD |
|
Patented Gas Inlet Minimizes Clogging |
|
Silicon Nitride |
|
Automatic Inlet Plunger Eliminates Downtime |
|
TEOS |
|
High Flow Spray Chambers |
|
Tungsten Deposition |
|
Unique Packed Column Design |
|
Ammonia |
|
Unique Packed Column Design |
|
Fluorosilanes |
|
PLC Based Scrubber Control Box |
|
Hydrogen Bromide |
|
Dry Contact Tool Interface / Interlock |
Metal etch |
|
“Standby Mode” Reduces Water Consumption to <1% of Standard Usage [~2GPM to ~1GPH]
|
|
Chlorine |
|
Footprint: 24.5” x 32.5” |
|
Hydrogen Chloride |
| |
|
|
Boron Trichloride |
