ELP-Izumi 200 - The Izumi Electroless Plating equipment is based on the ECP 200 design and features 200mm cells specifically designed to produce uniform and very high quality capping layers on copper interconnects. The tool has spray chambers for the pre-treatment and seeding steps and electroless chambers. A full suite of intermediate and post plating cleaning modules are also provided, including brush cleaning.
ELP-Izumi 300 - The Izumi Electroless Plating equipment is based on the ECP 300 design and features 300mm cells specifically designed to produce uniform and very high quality capping layers on copper interconnects. The tool has spray chambers for the pre-treatment and seeding steps and electroless chambers. A full suite of intermediate and post plating cleaning modules are also provided, including brush cleaning.
The E-REX 300 system is advanced electroplating equipment for 300mm copper damascene plating. Its unique design characteristics ensure that copper film is plated very uniformly on extremely thin seed layers.
With integrated backside/bevel cleaning and a chemical supply system, Ebara’s E-REX tool set can fulfil all your production needs and like Ebara’s CMP tools, the platform is extremely reliable.
ELP-Izumi 200 - The Izumi Electroless Plating equipment is based on the ECP 200 design and features 200mm cells specifically designed to produce uniform and very high quality capping layers on copper interconnects. The tool has spray chambers for the pre-treatment and seeding steps and electroless chambers. A full suite of intermediate and post plating cleaning modules are also provided, including brush cleaning.
