ELP-Izumi 200 - The Izumi Electroless Plating equipment is based on the ECP 200 design and features 200mm cells specifically designed to produce uniform and very high quality capping layers on copper interconnects. The tool has spray chambers for the pre-treatment and seeding steps and electroless chambers. A full suite of intermediate and post plating cleaning modules are also provided, including brush cleaning.
ELP-Izumi 300 - The Izumi Electroless Plating equipment is based on the ECP 300 design and features 300mm cells specifically designed to produce uniform and very high quality capping layers on copper interconnects. The tool has spray chambers for the pre-treatment and seeding steps and electroless chambers. A full suite of intermediate and post plating cleaning modules are also provided, including brush cleaning.
UFP300A - Automatic Ultra Fine Plating Specifications:
The UFP 300 series can accommodate all applications of “Through mask plating” processes (also called “patterned plating”), such as redistribution plating and solder bump plating in advanced packaging applications, including wafer level Chip Scale Packaging.
The UFP 300 A system is a fully automated system for high volume production and accommodates 300 mm wafer sizes. The semi-automated system (UFP 300 S) offers manual wafer loading in combination with automated wafer transfer between cells, or a fully manual system (UFP 300 M) is available which can be used for small volume production or R&D purposes.
The UFP series can be equipped with different plating cell and bath combinations for sequential multiple-stack plating applications, so is easily customisable to fulfill our customers specific needs.
ELP-Izumi 200 - The Izumi Electroless Plating equipment is based on the ECP 200 design and features 200mm cells specifically designed to produce uniform and very high quality capping layers on copper interconnects. The tool has spray chambers for the pre-treatment and seeding steps and electroless chambers. A full suite of intermediate and post plating cleaning modules are also provided, including brush cleaning.
