Chemical Mechanical Polishing Systems
Our Applications Engineering groups in Japan and the U.S. continue to push the envelope on the technologies required for tomorrow's devices. Whether this entails working on copper, low k dielectric planarization, or 300mm, EBARA has a chemical mechanical polishing system that meets your need.
EBARA has maintained its commitment to 300mm while many companies elected to postpone their programs. We now offers two models of 300mm CMP systems. Contact us for a demonstration of our 300mm tool in either an R&D or high-volume production environment today.
F-REX200 and F-REX300 chemical mechanical polishing systems are the enhanced versions of our dry in/dry out integrated clean CMP system. The F-REX200 offers a two-head, two-platen design with an optional buff station for greater process flexibility and increased throughput. The F-REX300 offers a two-head, two-platen and two-buff stations design, which allows for a customized process recipes and a 40% increase in throughput.