Semiconductor Engineering Services

EBARA's semiconductor engineering team is the worldwide leading supplier of Chemical Mechanical Polishing (CMP), Advanced Wafer Plating systems, Bevel and Backside Cleaning Treatment Systems. Learn more about our facilities and semiconductor engineering capabilities below.

  • Located in Sacramento, CA
  • Class 10 Cleanroom
  • Staffed by CMP Engineers

Engineering Study Capabilities

  • Customer Process Testing
  • Systems Reliability Testing
  • Customer Evaluations
  • Data Packages
  • Consumables Support (Development, Testing, Evaluation)
  • Retaining Ring Material & Design Studies
  • Conditioning Products Evaluations
  • Pad Development and Testing
  • Others

Equipment Available

  • FREX 300 - 300mm
  • ai Head G2/G2S
  • aiHead G3
  • TCM (R-ECM); S-OPM; ME-20
  • EPO112T – 300mm
  • Standard Head
  • EPO 112 – 200/150mm
  • Standard & aiHead G1/G2

Metrology Tools

  • Defects: SP1 TBI 200mm and 300mm
  • Topography( Dishing, Erosions, Planarity): HRP 320 200mm and 300mm
  • Film Thickness: Nanospec 8300 200mm and 300mm; UV1050 200mm; CDE 465 4 point probe 200mm and 300mm.
  • Wafer Inspection: Olympus defect renew station up to 1000X, 150mm 200mm and 300mm