The Ebara Technologies, Inc. Components Division supplies advanced vacuum and abatement technologies focused on semiconductor, photovoltaic and R&D. Components Division: Dry Vacuum Pumps, Turbomolecular Pumps, Point-of-Use Abatement, Exhaust Heaters & Traps, Vacuum Hardware, Related services
The Ebara Technologies, Inc. Systems Division supplies advanced technologies to front-end and back-end semiconductor manufacturing for 200 mm and 300mm. Systems Division: Chemical Mechanical Polishing (CMP), Wafer Plating Systems, Bevel and Backside Clean Treatment Systems
Ebara Technologies is taking new strides in order to provide the best maintenance for process operation and has created an innovative design to heat Nitrogen gas to temperatures of up to 200˚C. With a flow capacity of 300 SLM, this is an excellent source of heated dilution gas for maintaining smooth operation. LPCVD, Metal Etch, CVD, PECVD, FPD, and more can all benefit from heated dilution solutions to reduce undesirable temperature reactions during process. This unit was designed with a built-in Ebara VSN temperature controller for plug-and play operation, and works together with the Ebara 10” touchscreen OI.