EBARA’s wafer plating equipment is perfect for creating RF amplifiers, LEDs, CPU components, and more.
EBARA’s Bump Plating System uses dip plating equipment to accommodate a wide range plating processes. Its small footprint allows you to use a high-throughput wafer plating system while taking up minimum space.
The Copper Plating System uses a 65nm node and porous high resistor for excellent in-plane uniformity and process performance.
This device, a semiconductor wafer bump, rewiring, and forms of electroplating equipment installation clean room to form a fine pattern for wiring and mounting. Adopted by dip plating equipment to achieve the high quality of the plated bump and wiring. And compared with the conventional cup method, and succeeded in saving space even though it is a clean room with high throughput..