Bevel polishing system – Model EAC

List Price

EBARA’s Model EAC is a bevel polishing system to address an edge and/or its surrounding area of semiconductor wafer for defect removal.

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Bevel polishing system – Model EAC – Model EAC300bi-hv $0 0
Bevel polishing system – Model EAC – Model EAC300bi-wb $0 0

Description

EBARA’s Model EAC is a bevel polishing system to address an edge and/or its surrounding area of semiconductor wafer for defect removal.

Features

  • Robust Polish/Removal Capability using Fixed Abrasive
  • Contact Free concept to Device surface during process
  • Bevel Profile Control Capability
  • Wide/Flexible process area coverage (Top Edge ~ Bevel ~ Backside)