Description
EBARA’s Model EAC is a bevel polishing system to address an edge and/or its surrounding area of semiconductor wafer for defect removal.
Bevel polishing system – Model EAC
List Price
EBARA’s Model EAC is a bevel polishing system to address an edge and/or its surrounding area of semiconductor wafer for defect removal.
Features
- Robust Polish/Removal Capability using Fixed Abrasive
- Contact Free concept to Device surface during process
- Bevel Profile Control Capability
- Wide/Flexible process area coverage (Top Edge ～ Bevel ～ Backside)
© 2023 EBARA Technologies, Inc.
51 Main Avenue, Sacramento, CA 95838
