Chemical Mechanical Polishing Systems

Chemical Mechanical Polishing Systems

Ebara’s Applications Engineering groups in Japan and the U.S. continue to push the envelope required for tomorrow's devices. Whether this entails planarizing exotic new materials or providing proven solutions for today’s Copper, Oxide, Tungsten, or STI challenges across an array of technology nodes and device types, EBARA has a CMP system with industry leading technology options to meet your requirements.  Ebara is recognized as the benchmark for industry leading production and reliability standards and has been rewarded with continued year-over-year market share growth.

Ebara presently offers two 300mm models (FREX300S2 and FREX300X3SC) as well as a newly re-designed 200mm CMP system (FREX200M).  These systems incorporate the latest technologies into our dry in/dry out integrated clean CMP platforms. The 200mm F-REX200M offers a two-head, two-platen design for greater process flexibility and increased throughput. The F-REX300S2 and F-REX300X3SC offers a four head, four platen with three step clean design allowing for customized process recipes with the demonstrated capability to reliably meet 7nm technology requirements.  Ebara’s platforms are designed to operate like two tools in one (mirror image) providing both development and production flexibility while increasing throughput required for creating the reputation as best in class production reliability and total cost of ownership.

EBARA Technologies Inc. (ETI) also offers Refurbished CMP systems and ability to support both the 200mm (EPO-222, FREX-200) and the 300mm (FREX-300 and FREX-300S) models.  ETI has local field offices throughout the U.S. and Ebara Corp. has support personnel world-wide to support all product lines.  All refurbished systems are supported by experienced and highly trained Ebara engineers to support  installation, process development, technical support, service support, training support, and ongoing parts support.

Features & Benefits

  • Proven EPO model Concepts Utilized
    • Dry-In / Dry-Out
    • 1 head on platen, 2 platens, 4 cleaning stations
    • Module design
    • Manufacturing support options: EPM, SMIF, and etc.
  • Throughput (Maximum designed output based on 2 min polish)
    • 50 = Parallel / 2 steps clean, 40 = Parallel / 3 steps clean
    • 25 = Serial Mode
  • New Features
    • 3 Step Chemical Cleaning
    • Buff Polish

Specifications

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Model FREX200

Additional Information

EBARA's 200 mm CMP system, the F-REX200 utilizes EBARA's proven Dry-In / Dry-Out processing technology. The 2 platens, 1 head per platen deign with integrated four clean stations allows for flexibility in serial or parallel operation. Configuration options include: a Buff Polish Station, 4-Cassette Interface, Host Communication (Cim), Multiple Process Monitoring Capabilities, and Slurry/Chemical Supply Units. The FREX 200 is a flexible, user-oriented system.

Model FREX300

Additional Information

EBARA is proud to present its next generation 300 mm CMP system the F-REX300. This tool utilizes EBARA's proven Dry-In / Dry-Out processing technology. The two-head/two platen design with integrated four station cleaning allows for flexibility in serial or parallel operation. New features include 3-step chemical clean, buff stations, and 4 FOUP loader ports. The production proven platform extends EBARA's capabilities far beyond the next generation products. A 40% increase in throughput combined with industry leading features makes this the choice of many leading 300 mm fabs.