This device, a semiconductor wafer bump, rewiring, and forms of electroplating equipment installation clean room to form a fine pattern for wiring and mounting. Adopted by dip plating equipment to achieve the high quality of the plated bump and wiring. And compared with the conventional cup method, and succeeded in saving space even though it is a clean room with high throughput..
This device, a semiconductor wafer bump, rewiring, and forms of electroplating equipment installation clean room to form a fine pattern for wiring and mounting. Adopted by dip plating equipment to achieve the high quality of the plated bump and wiring. And compared with the conventional cup method, and succeeded in saving space even though it is a clean room with high throughput..
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